Chips 2020: A Guide to the Future of Nanoelectronics

Bernd Hoefflinger

Dec 2011 · Springer Science & Business Media

Ebook

477

Pages

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About this ebook

The chips in present-day cell phones already contain billions of sub-100-nanometer transistors. By 2020, however, we will see systems-on-chips with trillions of 10-nanometer transistors. But this will be the end of the miniaturization, because yet smaller transistors, containing just a few control atoms, are subject to statistical fluctuations and thus no longer useful. We also need to worry about a potential energy crisis, because in less than five years from now, with current chip technology, the internet alone would consume the total global electrical power!

This book presents a new, sustainable roadmap towards ultra-low-energy (femto-Joule), high-performance electronics. The focus is on the energy-efficiency of the various chip functions: sensing, processing, and communication, in a top-down spirit involving new architectures such as silicon brains, ultra-low-voltage circuits, energy harvesting, and 3D silicon technologies. Recognized world leaders from industry and from the research community share their views of this nanoelectronics future. They discuss, among other things, ubiquitous communication based on mobile companions, health and care supported by autonomous implants and by personal carebots, safe and efficient mobility assisted by co-pilots equipped with intelligent micro-electromechanical systems, and internet-based education for a billion people from kindergarden to retirement. This book should help and interest all those who will have to make decisions associated with future electronics: students, graduates, educators, and researchers, as well as managers, investors, and policy makers.

About the author

About the Editor Prof. Hoefflinger has a lifelong career with semiconductor chips: After starting at Siemens Research, he was invited to join the faculty at Cornell University, where he set up and taught the first graduate course on integrated circuits (IC’s). He continued as the first product manager for MOS IC’s, Siemens, Munich. With that experience, he became a co-founder of the University of Dortmund, where he built the first public pilot line for IC’s in Europe, which realized the world’s first all-ion-implanted Bipolar-CMOS process. As Head of the Electrical Engineering Departments at the University of Minnesota and at Purdue University, he led the major expansions of their electronics programs. He was invited back to Germany to build and lead the Institute for Microelectronics Stuttgart. As a public enterprise for contract R&D, it became one of the first certified manufacturing lines in Europe for CMOS Application-Specific Circuits. It has become the world leader in the development and manufacture of test masks for every next-generation lithography since the 1990’s. Bernd Hoefflinger has been the recipient or co-recipient of numerous scientific and best-product awards. He is a member of the Dusseldorf Academy of Sciences

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