Additive and Subtractive Manufacturing Processes: Principles and Applications

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· CRC Press
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Om den här e-boken

This reference text discusses fundamentals, classification, principles, applications of additive and subtractive manufacturing processes in a single volume.

The text discusses 3D printing techniques with the help of practical case studies, covers rapid tooling using microwave sintering and ultrasonic assisted sintering process, and covers different hybrid manufacturing techniques like cryo-MQL, and textured cutting inserts. It covers important topics including green manufacturing, ultrasonic assisted machining, electro thermal based non-conventional machining processes, metal based additive manufacturing, LASER based additive manufacturing, indirect rapid tooling, and polymer based additive manufacturing.

The book:

  • Discusses additive and subtractive manufacturing processes in detail
  • Covers hybrid manufacturing processes
  • Provides life cycle analysis of conventional machining
  • Discusses biomedical and industrial applications of additive manufacturing

The text will be useful for senior undergraduate, graduate students, and academic researchers in areas including industrial and manufacturing engineering, mechanical engineering, and production engineering.

Discussing the sustainability aspects of conventional machining in reducing carbon footprint of machining by adopting different hybrid and non-conventional machining processes, this text will be useful for senior undergraduate, graduate students, and academic researchers in areas including industrial and manufacturing engineering, mechanical engineering, and production engineering.

Om författaren

Dr. Varun Sharma completed his B.Tech. degree from Guru Nanak Dev Engineering College in 2011securing first position and got Master’s degree from Guru Nanak Dev Engineering College in 2013 in Production Engineering specialization. He joined IIT Roorkee as a faculty member in 2018 and presently serving as assistant professor in Department of Mechanical and Industrial Engineering at Indian Institute of Technology, Roorkee, Uttarakhand, India. He has 8 years of experience in research and teaching. He has published 35 research papers in peer reviewed journals and 11 in national and international conferences. His research interest includes Conventional machining processes, Non-conventional machining processes, Machining and process optimization, Ultrasonic assisted machining, Additive manufacturing/ 3D Printing, Mechanical and biomedical applications.

Dr. Pulak M. Pandey completed his B.Tech. degree from H.B.T.I. Kanpur in 1993 securing first position and got Master’s degree from IIT Kanpur in 1995 in Manufacturing Science specialization. He served H.B.T.I. Kanpur as faculty member for approximately 8 years and also completed Ph.D. in the area of Additive Manufacturing/3D Printing from IIT Kanpur in 2003. He joined IIT Delhi as a faculty member in 2004 and is presently serving as Professor. In IIT Delhi, Dr Pandey diversified his research areas in the field of micro and nano finishing, micro-deposition and also continued working in the area of 3D Printing. He supervised 41 PhDs and more than 36 MTech theses in last 10 years and also filed 22 Indian patent applications. He has approximately 201 international journal papers and 48 international/national refereed conference papers to his credit. These papers have been cited for more than 7575 times with h-index as 43. He received Highly Commended Paper Award by Rapid Prototyping Journal for the paper "Fabrication of three dimensional open porous regular structure of PA 2200 for enhanced strnegth of scaffold using selective laser sintering" published in 2017. Many of his B.Tech. and M.Tech. supervised projects have been awarded by IIT Delhi. He is recipient of Outstanding Young Faculty Fellowship (IIT Delhi) sponsored by Kusuma Trust, Gibraltar and J.M. Mahajan outstanding teacher award of IIT Delhi. His students have won GYTI (Gandhian Young Technological Innovation Award) in 2013, 2015, 2017, 2018 and 2020 .

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